Product overview
概述Part of the same high-toughness engineering family as ENTG10, XC-ENTG17 keeps 68 J/m impact strength and 65% elongation at break while raising hardness to 80 Shore D — the right balance when a part must absorb impact yet hold a stiffer, more abrasion-resistant surface. Properties are locked in after printing with over 90% mechanical retention: no deformation under load, no cracking in storage, and direct use for small-batch end parts.
- The resin cures under UV light and will also cure slowly in sunlight.
- After printing, keep supports on, clean the part and bake at 110 °C for 1 hour.
Applications
应用Technical data
技术参数| Flexural Strength弯曲强度 | 35MPa |
|---|---|
| Flexural Modulus弯曲弹性模量 | 1200MPa |
| Tensile Strength拉伸强度 | 31MPa |
| Tensile Modulus拉伸弹性模量 | 1200MPa |
| Elongation at Break断裂延伸率 | 65% |
| Hardness硬度 | 80Shore D |
| Impact Strength冲击强度 | 68J/m |
| Viscosity粘度 | 1000 ± 200cps |
Values above are the ones documented in our internal data. Nothing is extrapolated. Formal test conditions and standards are stated in the TDS.
Printing & post-processing
工艺| Light source适配光源 | 385–405nm LCD / DLP |
|---|---|
| Exposure曝光 | 2–3 s @ 4000–5000 μW/cm² |
| Layer height层厚 | Not provided |
| Post-cure后固化 | Bake at 110 °C for 1 h with supports attached |
Layer height and exposure depend on machine intensity, resin temperature and cross-section; parameters not listed are not recommended.
Other materials in this family
Need a material recommendation, or a sample?
Tell us the service conditions, your printer and the target properties. We will come back with a material recommendation and a starting process window.