XRESIN
Engineering Resins High-Toughness Engineering Resin XC-ENTG10
XC-ENTG10Engineering Resins

High-Toughness Engineering Resin

工程类高韧树脂

Print-and-use · toughness that lasts

Jigs & fixturesPrototype validationDesign collectibles
1000 g / bottle 385–405 nm LCD / DLP 1 year, store away from light in a cool place
02Key performance
65%Elongation at Break
68J/mImpact Strength
75Shore DHardness
35MPaFlexural Strength
01

Product overview

概述

XC-ENTG10 solves the industry-wide problem of toughness fade. Parts are ready to use straight off the platform and keep their mechanical profile over time: retention above 90%, no creep under load, no cracking in storage. Scratch and abrasion resistance, elevated heat resistance, excellent dimensional stability and good chemical resistance bring the material in line with ABS — enabling small-batch production without tooling. From heavy-duty jigs and fixtures to product housings, high-demand prototypes to collectible models, the printed part is the end part.

  • The resin cures under UV light and will also cure slowly in sunlight.
  • After printing, keep supports on, clean the part and bake at 110 °C for 1 hour.
03

Applications

应用
Jigs & fixturesPrototype validationDesign collectiblesBridge production
04

Technical data

技术参数
Flexural Strength弯曲强度35MPa
Flexural Modulus弯曲弹性模量1200MPa
Tensile Strength拉伸强度31MPa
Tensile Modulus拉伸弹性模量1200MPa
Elongation at Break断裂延伸率65%
Hardness硬度75Shore D
Impact Strength冲击强度68J/m
Viscosity粘度1000 ± 200cps

Values above are the ones documented in our internal data. Nothing is extrapolated. Formal test conditions and standards are stated in the TDS.

05

Printing & post-processing

工艺
Light source适配光源385–405nm LCD / DLP
Exposure曝光2–3 s @ 4000–5000 μW/cm²
Layer height层厚Not provided
Post-cure后固化Bake at 110 °C for 1 h with supports attached

Layer height and exposure depend on machine intensity, resin temperature and cross-section; parameters not listed are not recommended.

XRESIN · Sales & engineering

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